Innominds, an AI-first digital engineering company, and SIIX Corporation, a global leader in electronics manufacturing and supply chain services, today announced that they have entered into a joint venture to establish SIIX-Innominds Pvt. Ltd. in India.
The SIIX-Innominds JV will serve as a single-source partner for OEMs, offering full-stack Original Design & Manufacturing (ODM) services spanning Device, Cloud, and AI. Combining Innominds’ capabilities in AI-driven device-to-cloud design, engineering, and software with SIIX’s global manufacturing expertise, sourcing network, and supply chain leadership, will accelerate product innovation and streamline the Spec-to-Ship journey for global customers. The partnership reinforces a long-term commitment to drive intelligent, full-stack, Device to Cloud solution development across Hi-tech, Automotive, Med-tech, and Manufacturing sectors.
“The SIIX-Innominds collaboration further strengthens our offerings and provides clients with an end-to-end platform that eliminates fragmentation in product development, reduces risks, costs, and time-to-market while ensuring the highest quality standards. Together, we enable OEMs to focus on strategy and R&D, while we deliver execution at scale.” said Anil Kumar Katakam, Partner & Chief Operating Officer, Innominds.
Mr.KazuyaHiraoka, Chief Operating Officer & President, SIIX Corporation, added: “Our global manufacturing excellence, strategic sourcing, and fulfilment capabilities, combined with role as Global Business Organizer and Innominds’ design and AI expertise, form a compelling value proposition for strategic partners across the globe. With this partnership, we aim to provide customers full-stack Original Design & Manufacturing (ODM) services from concept to production supported by a one stop strategic partner.”
Key Offerings
- Design & Engineering Excellence: AI-driven device-to-cloud solutions, hardware, software, industrial design, and rigorous quality validation.
- Manufacturing Leadership: 12+ Best in class facilities worldwide offering scalable production, strategic component sourcing, and end-to-end logistics.
- Unified Spec-to-Ship Process: A fully integrated model minimizing technical risk, reducing time-to-market, and lowering overall development costs.
- Global Reach: A footprint across Asia-Pacific, Japan, the Americas, and Europe to support OEMs with local sourcing and fulfillment.