Vertiv, a global provider of critical digital infrastructure and continuity solutions, today announced the launch of the Vertiv™ CoolLoop RDHx, a chilled water, high density rear door heat exchanger designed to support the increasing thermal demands of AI, high-performance computing, and other power-dense IT workloads. Now available globally in capacities up to 80kW per rack, the solution is an extension of the Vertiv™ Liebert® DCD rear door heat exchanger family and part of Vertiv’s industry-leading thermal management portfolio.
The Vertiv CoolLoop RDHx is a compact, energy-efficient air-cooling door replacement that may be deployed as a standalone solution or can support direct-to-chip liquid cooling for a room-neutral solution. The system’s integrated fan module delivers precise airflow control, reducing energy consumption while optimizing cooling performance.
The Vertiv CoolLoop RDHx offers key features that enhance adaptability and efficiency in diverse rack configurations.
· Modular compatibility allows installation on 600mm and 800mm-wide IT racks, with optional height adapters available for flexible deployment.
· Primary and secondary cooling circuit integration enables both the connection to the primary cooling networks and the connection to liquid cooling infrastructure, enhancing system-wide thermal efficiency.
· Pressure-independent control valve option provides precise regulation of chilled water flow, optimizing cooling performance.
“As liquid cooling is adopted to remove heat from AI servers, it’s necessary to find a streamlined solution to eliminate the additional air loaded heat,” said Nigel Gore, vice president of high- density liquid cooling at Vertiv. “The Vertiv™ CoolLoop RDHx features a space-saving rear-door configuration and integrates seamlessly with the liquid cooling loop, simplifying heat dissipation while maintaining efficiency and scalability for high-density environments.”
“We are seeing rapid adoption of AI and HPC workloads across India’s enterprises and research institutions, which is driving the need for efficient, scalable thermal solutions,” said Preetam Shah – director product management, Vertiv India. “The Vertiv CoolLoop RDHx enables Indian data centre operators to manage extreme rack densities without compromising on energy efficiency or room capacity, helping customers extract more value from their compute investments while meeting the uptime goals. We look forward to partnering with local system integrators and customers to deliver tailored cooling deployments that meet India’s unique operational and environmental needs.”
Vertiv CoolLoop RDHx can be supported by Vertiv Liquid Cooling Services, a new offering portfolio that provides comprehensive lifecycle support for the entire liquid cooling ecosystem, from design and installation to maintenance and fluid management.