On April 19, 2026, Union minister Ashwini Vaishnaw officially laid of the foundation stone for India’s first advanced 3D semiconductor packaging facility at Info Valley in Bhubaneswar, Odisha. The project introduces glass-based substrate technology used in high-end computing, marking a shift in India’s electronics manufacturing capabilities. The plant will focus on 3D Glass Substrate packaging, a method that allows chips to perform faster and use less power compared to traditional plastic or ceramic materials.
The project is being executed through Heterogeneous Integration Packaging Solutions (HIPSPL), an Indian subsidiary of 3D Glass Solutions Inc. The facility represents a total investment of Rs. 1,943.53 crore, funding includes Rs. 799 crore central government support through the India Semiconductor Mission, while approximately Rs.399.5 crore is being invested by the state government.
Production goals and timelines
The facility will operate as a vertically integrated unit. It will handle both Advanced Trenched Micro-Packaging (ATMP) and embedded glass substrate manufacturing. Key production targets include:
- Annual Output: 70,000 glass panels.
- Unit Volume: 50 million assembled units and 13,000 3DHI modules.
- Commercial Start: Scheduled for August 2028.
- Full-Scale Production: Expected by August 2030.
The strategic impact
Chief Minister Mohan Charan Majhi stated that the facility makes Odisha the only Indian state to host both a compound semiconductor fabrication unit and a 3D glass substrate plant.
The technology produced is the state serves several sectors including artificial intelligence, telecommunications, defense and aerospace by powering data centres and machine learning models, supporting the rollout of 5G and future 6G networks, and creating radar systems and advance digital electronics respectively.
The growth projection
Union Minister Ashwini Vaishnaw noted that India’s electronics production grew six times over the past 12 years. He confirmed that the government has approved two semiconductor projects for Odisha , with three more proposals currently under review.
In terms to support this industrial growth, the government is investing Rs. 90,000 crore in Odisha’s railway infrastructure. This includes redeveloping 59 stations and building a four-line coastal rail corridor from Balasore to Berhampur to improve freight and passenger movement.
The state government is also providing stipends to engineering and ITI students. This initiative aims to prepare a local workforce for the technical roles required by the new semiconductor ecosystem. Local officials expect the project to create direct employment for thousands of graduates in the region.